NINGBO CHIPEX SEMICONDUCTOR CO.,LTD
Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo
P.O:315327
Mail:sales@chipex.cn
Tel:(86)-574-63078606;
(86)-574-63078608-8858
Making TVS devices by using Wafer-Level Packaging technology can obviously reduce device size and significantly improve electrical performance and reliability, shorten the package time and lower cost, which was widely used in mobile phones, MP3 players, PDAs and digital cameras and other portable electronic products to provide protection and improve its reliability.
ltem | Standard | Other |
Die Size Without Dicing Street | 570x270um | NA |
Dicing Street | 60um | No metal allowed in the dicing street |
Bump pitch | 400um within | Follow customer requirement |
Bump Size | 120X210um | Follow customer requirement |
Bump Height | 11um(Cu 8um+Sn 3um) | Only Bake and no feflow allowed |
BG Thickness | 265um | Follow customer requirement |