NINGBO CHIPEX SEMICONDUCTOR CO.,LTD
Add：No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo
P.O：315327
Mail：sales@chipex.cn
Tel：(86)-574-63078606；
(86)-574-63078608-8858
Providing wafer-level packaging services including wafer-level chip-scale packaging, plating solder, copper bump process, RDL and so on.
Providing variety of flip-chip packaging and packaging line including QFN, DFN, SOT, SOP, LGA and BGA, etc to the traditional packaging factories cooperated.
A. Wafer Level Package
| Package | Solder Bump | Pillar Bump | WLCSP | RDL |
| Wafer Size | 6and 8 inch | |||
| UBM | Ti/Cu | |||
| Material | Solder | Cu/Sn,Cu/SnAG | Leadfree | Al,Cu,Ni/Pd/Au,Ni/Au |
| Min.Pitch | 150um | 90um | 300um | L/S:10/10um |
| Repassivation | Pl,SMF,LowTem.Pl,PBO | |||
B. Flip Chip Package
Package Type:LGA/BGA,QFN,DFN,SOT,SOP can be provided by ChipEx and assembly packing partners.
C. Product Features
