The 13th China International Semiconductor Exposition and Summit was held in Shanghai New International Expo Center

The 13th China International Semiconductor Exposition and Summit (Hereinafter referred to as IC CHINA2015) was held in Shanghai New International Expo Center. The theme of this IC CHINA2015 was “Implementation of the document, accelerate the industrial development", aiming to create the most influential national semiconductor industry platform, showing IC Design & Products, IC Design Tools & Services, Chip Manufacturing, Packaging & Testing, Semiconductor Professional Equipment & Components, Semiconductor Materials, IC Applications & Solutions, Semiconductor Discrete, Semiconductor Optoelectronics, Power Devices, Sensors, ICs Smart home, portable terminal, automotive electronics, LED, health care and other IC applications.

This IC CHINA2015 created the Asian electronics industry's largest display platform and the highest standard industry event, was held by the China Semiconductor Industry Association, China Electronic Equipment Corporation and Shanghai Municipal Economic and Information Commission, jointly to create the Asian electronics industry's largest display platform, the highest specifications industry event. This IC CHINA2015 attracted more than 60,000 spectators and achieved the linkage between audience and sellers.

This IC CHINA2015 brought TSINGHUA UNIGROUP, Jiangsu Electronics Technology, APEXMIC and some other IC leading enterprises together. And also including Wuxi base, Shenzhen base, Jinan base and some other IC industries throughout the country-based, at the same time, Liaoning grassroots circuit industry alliance also stunning debut. Datang Telecom and Huada semiconductor co.,ltd represent Semiconductor National Team also appeared. IC CHINA2015 also brought Freescale, NXP Semiconductors, AMS, PDF Solutions and other European and American companies together, also including Japanese companies such as Disco and Panasonic, and the South Korean company represented by Maps. This IC CHINA2015 made domestic and foreign resources together and created an international display platform.

ChipEx as a rising star of advanced semiconductor packaging and testing also participated in this Summit Forum. ChipEx mainly operating Wafer Level Packaging. Because of the small size, low cost and good electrical characteristics, ChipEx’s products are widely used at mobile phones, tablet, smart bracelets and other consumer electronics products which have a high requirement on the size and cost. During the exhibition, ChipEx received wide attention of design companies, consumer products and terminal companies.