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NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

P.O:315327

Mail:sales@chipex.cn

Tel:(86)-574-63078606;

          (86)-574-63078608-8858


CuPillar

Current Location: Home >> Technology >> CuPillar

    Copper pillar process is making copper-tin bumps on the surface of the chip for "point-of-connection" between the chips or the chips and the substrates by utilizing gluing, litho, electroplating and etching process and other production technology through the surface of the chip in the production of copper and tin bumps after wafer processing of the substrate circuit. The array of bumps on the die surface allows pin density to be higher due to the elimination of the traditional "wire bonding" to the surrounding metal, reducing the area of the chip to meet the performance requirements of the chip, low resistance, low parasitic capacitance, low inductance, low power consumption, low signal-to-noise ratio, low cost, and so on.



Cu-Pillar StructurePI ThicknessStandard Cu-PillarMicro Cu-Pillar

1M

(Dirctl Cu-Pillar)

NA

Pitch:150um

Bump Size:80-100um

Bunp Height:

65um Cu+35um Sn

Min.Pitch:90um

Min.Bump Size:45um

Bum Hemp:

25um Cu+20um Sn

1P1M

(PI+Cu-Pillar)

5um

1P2M

(PI+RDL+Cu-Pillar)

5um

2P2M

1st PI+RDL+2ndPI+Cu-Pillar

1st PI5um

2ndPI 10um 



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Application:

PMU.Smart.Card.RF.PA.MEMS&Sensor.ucontrollers.EEPROM/Dram/Flash/SRAM


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